Kulicke and Soffa Industries Inc.  

(Public, NASDAQ:KLIC)   Watch this stock  
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22.02
-0.27 (-1.21%)
Feb 16 - Close
NASDAQ real-time data - Disclaimer
Currency in USD
Range 22.00 - 22.41
52 week 18.22 - 28.71
Open 22.22
Vol / Avg. 0.00/693,073.00
Mkt cap 1.55B
P/E 62.15
Div/yield     -
EPS 0.35
Shares 70.61M
Beta 1.36
Inst. own 88%
May 2, 2018
Q2 2018 Kulicke and Soffa Industries Inc Earnings Release (Estimated) - 9:30AM EDT - Add to calendar
May 1, 2018
Q2 2018 Kulicke and Soffa Industries Inc Earnings Release (Estimated) - 9:30AM EDT - Add to calendar
Mar 14, 2018
Kulicke and Soffa Industries Inc Annual Shareholders Meeting (Estimated) - 4:30AM EDT - Add to calendar
Mar 6, 2018
Kulicke and Soffa Industries Inc Annual Shareholders Meeting - 3:30AM EST - Add to calendar
Jan 31, 2018
Q1 2018 Kulicke and Soffa Industries Inc Earnings Call - Webcast
Jan 31, 2018
Q1 2018 Kulicke and Soffa Industries Inc Earnings Release
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Key stats and ratios

Q4 (Dec '17) 2017
Net profit margin -32.45% 13.82%
Operating margin 18.05% 12.14%
EBITD margin - 18.26%
Return on average assets -23.88% 10.38%
Return on average equity -31.54% 13.03%
Employees 2,778 -
CDP Score - -

Address

23A Serangoon North Avenue 5 #01-01 K&S Corporate Headquarters
FORT WASHINGTON, 554369
Singapore
+65-6-8809600 (Phone)
+65-6-8809580 (Fax)

Website links

External links

Analyst Estimates - MarketWatch
SEC Filings - EDGAR Online
Major Holders - MSN Money

Description

Kulicke and Soffa Industries, Inc. designs, manufactures and sells capital equipment and expendable tools, as well as services, maintains, repairs and upgrades equipment, all used to assemble semiconductor devices. The Company supplies a range of bonding equipment. The Company operates through two segments: Equipment and Expendable Tools. The Equipment segment manufactures and sells a line of ball bonders, wedge bonders, advanced packaging and surface mount technology solutions. The Expendable Tools segment manufactures and sells expendable tools for a range of semiconductor packaging applications. It offers capital equipment and expendable tools used to assemble semiconductor devices, including integrated circuits, high and low powered discrete devices, light-emitting diodes and power modules. Its customers primarily consist of semiconductor device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers and automotive electronics suppliers.

Officers and directors

Garrett E. Pierce Chairman of the Board
Age: 72
Bio & Compensation  - Reuters
Fusen Ernie Chen President, Chief Executive Officer, Director
Age: 57
Bio & Compensation  - Reuters
Lester A. Wong J.D. Interim Chief Financial Officer, Senior Vice President - Legal Affairs, Interim Chief Accounting Officer, General Counsel
Age: 50
Bio & Compensation  - Reuters
Hoang Huy Hoang Senior Vice President - Global Sales and Products and Services
Bio & Compensation  - Reuters
Chan Pin Chong Senior Vice President , Electronic Assembly, Advanced Packaging-Hybrid, Wedge Bonder, Capillaries and Blades Business Lines
Age: 48
Bio & Compensation  - Reuters
Irene Lee Senior Vice President, Global Operations and Chief Quality Officer
Age: 56
Bio & Compensation  - Reuters
Deepak K. Sood Ph.D. Vice President - Global Engineering
Age: 55
Bio & Compensation  - Reuters
Nelson Wong Vice President - Ball and Die Bonder Business Unit Management
Age: 56
Bio & Compensation  - Reuters
Brian R. Bachman Independent Director
Age: 72
Bio & Compensation  - Reuters
Peter Tat-Ming Kong Independent Director
Age: 66
Bio & Compensation  - Reuters