Taiwan Semiconductor Mfg. Co. Ltd. (ADR)  

(Public, NYSE:TSM)   Watch this stock  
Find more results for TSM
42.07
-0.03 (-0.07%)
Nov 17 - Close
NYSE real-time data - Disclaimer
Currency in USD
Range 41.97 - 42.42
52 week 28.34 - 42.71
Open 42.24
Vol / Avg. 3.70M/4.41M
Mkt cap 208.34B
P/E 18.69
Div/yield 1.15/2.74
EPS 2.25
Shares 25.93B
Beta 0.77
Inst. own 4%
Jan 18, 2018
Q4 2017 Taiwan Semiconductor Manufacturing Co Ltd Earnings Call Add to calendar
Jan 18, 2018
Q4 2017 Taiwan Semiconductor Manufacturing Co Ltd Earnings Release Add to calendar
Jan 10, 2018
December 2017 Taiwan Semiconductor Manufacturing Co Ltd Corporate Sales Release Add to calendar
Dec 8, 2017
November 2017 Taiwan Semiconductor Manufacturing Co Ltd Corporate Sales Release Add to calendar
Nov 10, 2017
October 2017 Taiwan Semiconductor Manufacturing Co Ltd Corporate Sales Release
Oct 19, 2017
Q3 2017 Taiwan Semiconductor Manufacturing Co Ltd Earnings Call - Webcast
Oct 19, 2017
Q3 2017 Taiwan Semiconductor Manufacturing Co Ltd Earnings Release
Oct 6, 2017
September 2017 Taiwan Semiconductor Manufacturing Co Ltd Corporate Sales Release
Sep 11, 2017
Taiwan Semiconductor Manufacturing Co Ltd at CLSA Investors' Forum
Sep 7, 2017
Taiwan Semiconductor Manufacturing Co Ltd at Credit Suisse Technology Conference
More events from DailyFinance »    

Key stats and ratios

Q2 (Jun '17) 2016
Net profit margin 30.99% 35.27%
Operating margin 38.93% 39.85%
EBITD margin - 63.48%
Return on average assets 13.56% 18.87%
Return on average equity 19.01% 25.60%
Employees 46,968 -
CDP Score - A-

Address

No.8 Li-Hsin Road 6, Hsinchu Science Park
HSINCHU, 300
Taiwan
+886-3-5636688 (Phone)
+886-3-5790893 (Fax)

Website links

External links

Analyst Estimates - MarketWatch
SEC Filings - EDGAR Online
Major Holders - MSN Money
Transcripts - SeekingAlpha

Description

Taiwan Semiconductor Manufacturing Company Limited (TSMC) is a semiconductor foundry. The Company is engaged in the manufacturing, selling, packaging, testing and computer-aided design of integrated circuits and other semiconductor devices and the manufacturing of masks. It operates through foundry segment. The foundry segment is engaged in manufacturing, selling, packaging, testing and computer-aided design of integrated circuits (IC) and other semiconductor devices and the manufacturing of masks. It operates three 12-inch wafer fabs, four eight-inch wafer fabs, one six-inch wafer fab (fab 2) and two backend fabs (advanced backend fab 1 and 2). It also manages two eight-inch fabs at its subsidiaries, WaferTech, LLC in the United States and TSMC China Company Limited. Its exploratory work focuses on transistors and technologies, such as three dimensional (3D) structures, strained-layer complementary metal-oxide semiconductor (CMOS), high-mobility materials and 3D IC devices.

Officers and directors

Morris Chang Chairman of the Board
Bio & Compensation  - Reuters
Mark Liu Chairman of the Board
Bio & Compensation  - Reuters
C.C. Wei President, Director
Bio & Compensation  - Reuters
F.C. Tseng Vice Chairman of the Board
Bio & Compensation  - Reuters
Lora Ho Chief Financial Officer, Senior Deputy General Manager-Finance
Bio & Compensation  - Reuters
Jack Sun Chief Technology Officer, Deputy General Manager-Research Development & Technology Development
Bio & Compensation  - Reuters
Stephen T. Tso Chief Information Officer, Senior Deputy General Manager-Information Technology & Material & Risk Management
Bio & Compensation  - Reuters
Sylvia Fang General Counsel, Deputy General Manager-Legal
Bio & Compensation  - Reuters
Rick Cassidy Senior Deputy General Manager, General Manager - North America Subsidiary
Bio & Compensation  - Reuters
Y.P. Chin Senior Deputy General Manager-Operations/Products Development
Bio & Compensation  - Reuters