Tong Hsing Electronic Industries, Ltd. is principally engaged in the development and manufacture of micro modules and custom semiconductor packages. The Company’s products are mainly classified into four categories: high frequency (HF) wireless communication modules, mixed integrated circuit (IC) modules, ceramic printed circuit boards (PCBs) and image products. Its products portfolio consists of power-amplifier (PA) modules, radio frequency (RF) front end modules, high brightness light emitting diode (LED) substrates, thick film substrates and mixed ICs for automobile electronics, as well as mixed ICs for military electronics and medical electronics, among others. The Company is also involved in wafer reconstructing and circuit probing. It distributes its products mainly to the Americas and Europe. The Company is also involved in wafer reconstructing and circuit probing.