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Disco Corp
Previous close
¥54,130.00
Day range
¥49,270.00 - ¥52,330.00
Year range
¥14,360.00 - ¥57,850.00
Market cap
5.40T JPY
Avg Volume
2.59M
P/E ratio
72.71
Dividend yield
0.58%
Primary exchange
TYO
Market news
Financials
Income Statement
Revenue
Net income
(JPY) | Dec 2023info | Y/Y change |
---|---|---|
Revenue | 77.00B | 16.94% |
Operating expense | 22.31B | 18.39% |
Net income | 16.07B | -2.86% |
Net profit margin | 20.87 | -16.95% |
Earnings per share | — | — |
EBITDA | 32.94B | 24.82% |
Effective tax rate | 26.52% | — |
Balance Sheet
Total assets
Total liabilities
(JPY) | Dec 2023info | Y/Y change |
---|---|---|
Cash and short-term investments | 172.22B | 23.39% |
Total assets | 496.09B | 14.14% |
Total liabilities | 126.43B | 13.25% |
Total equity | 369.65B | — |
Shares outstanding | 108.34M | — |
Price to book | 15.87 | — |
Return on assets | 15.36% | — |
Return on capital | 20.79% | — |
Cash Flow
Net change in cash
(JPY) | Dec 2023info | Y/Y change |
---|---|---|
Net income | 16.07B | -2.86% |
Cash from operations | — | — |
Cash from investing | — | — |
Cash from financing | — | — |
Net change in cash | — | — |
Free cash flow | — | — |
About
DISCO Corporation is a Japanese precision tools maker, especially for the semiconductor production industry.
The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength. Wikipedia
Founded
May 5, 1937
Website
Employees
4,553