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Disco Corp
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Financials
Income Statement
Revenue
Net Income
Revenue
Net income
| (JPY) | Jun 2025info | Y/Y change |
|---|---|---|
Revenue | 89.91B | 8.59% |
Operating expense | 27.02B | 11.06% |
Net income | 23.77B | 0.23% |
Net profit margin | 26.43 | -7.72% |
Earnings per share | — | — |
EBITDA | 34.48B | -4.55% |
Effective tax rate | 29.36% | — |
Balance Sheet
Total Assets
Total Liabilities
Total assets
Total liabilities
| (JPY) | Jun 2025info | Y/Y change |
|---|---|---|
Cash and short-term investments | 198.50B | -9.08% |
Total assets | 620.08B | 10.94% |
Total liabilities | 135.16B | -10.94% |
Total equity | 484.92B | — |
Shares outstanding | 108.42M | — |
Price to book | 10.51 | — |
Return on assets | — | — |
Return on capital | — | — |
Cash Flow
Net Change in Cash
Net change in cash
| (JPY) | Jun 2025info | Y/Y change |
|---|---|---|
Net income | 23.77B | 0.23% |
Cash from operations | — | — |
Cash from investing | — | — |
Cash from financing | — | — |
Net change in cash | — | — |
Free cash flow | — | — |
Previous close
¥46,970.00
Day range
¥41,870.00 - ¥44,700.00
Year range
¥22,640.00 - ¥56,950.00
Market cap
4.65T JPY
Avg Volume
5.22M
P/E ratio
37.61
Dividend yield
0.96%
Primary exchange
TYO
About
DISCO Corporation is a Japanese precision tools maker, especially for the semiconductor production industry.
The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength.
The company is listed on the Tokyo Stock Exchange, where it is a component of the Nikkei 225 index. Wikipedia
Founded
May 5, 1937
Website
Employees
5,256
