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Disco ADR
Previous close
$30.90
Day range
$30.94 - $31.52
Year range
$11.73 - $38.73
Market cap
5.04T JPY
Avg Volume
45.86K
Market news
CNBC
13 minutes ago
Stock futures are little changed after Dow posts four-day win streak: Live
updates
0.46%
Financials
Income Statement
Revenue
Net income
| (JPY) | Mar 2024info | Y/Y change |
|---|---|---|
Revenue | 90.65B | 14.72% |
Operating expense | 23.76B | 19.10% |
Net income | 25.75B | 0.30% |
Net profit margin | 28.41 | -12.56% |
Earnings per share | — | — |
EBITDA | 41.15B | 21.49% |
Effective tax rate | 24.60% | — |
Balance Sheet
Total assets
Total liabilities
| (JPY) | Mar 2024info | Y/Y change |
|---|---|---|
Cash and short-term investments | 215.49B | 32.16% |
Total assets | 556.06B | 18.61% |
Total liabilities | 149.50B | 23.80% |
Total equity | 406.56B | — |
Shares outstanding | 108.35M | — |
Price to book | 0.01 | — |
Return on assets | 17.19% | — |
Return on capital | 23.51% | — |
Cash Flow
Net change in cash
| (JPY) | Mar 2024info | Y/Y change |
|---|---|---|
Net income | 25.75B | 0.30% |
Cash from operations | 28.01B | — |
Cash from investing | -4.39B | — |
Cash from financing | -4.09B | — |
Net change in cash | 19.82B | — |
Free cash flow | 22.44B | — |
About
DISCO Corporation is a Japanese precision tools maker, especially for the semiconductor production industry.
The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength. Wikipedia
Founded
May 5, 1937
Website
Employees
4,553
