Kulicke and Soffa Industries Inc.  

(Public, NASDAQ:KLIC)   Watch this stock  
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27.53
+0.73 (2.72%)
Real-time:   10:36AM EST
NASDAQ real-time data - Disclaimer
Currency in USD
Range 27.07 - 27.68
52 week 14.94 - 28.71
Open 27.13
Vol / Avg. 97,590.00/561,842.00
Mkt cap 1.94B
P/E 17.72
Div/yield     -
EPS 1.55
Shares 70.60M
Beta 1.34
Inst. own 89%
Jan 31, 2018
Q1 2018 Kulicke and Soffa Industries Inc Earnings Release (Estimated) - 9:30AM EST - Add to calendar
Nov 14, 2017
Q4 2017 Kulicke and Soffa Industries Inc Earnings Release
Nov 14, 2017
Q4 2017 Kulicke and Soffa Industries Inc Earnings Call - Webcast
Sep 20, 2017
Kulicke and Soffa Industries Inc at Singular Research Chicago Midwestern Values Conference
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Key stats and ratios

Q3 (Sep '17) 2017
Net profit margin 16.85% 13.82%
Operating margin 17.09% 12.14%
EBITD margin - 19.56%
Return on average assets 11.68% 10.38%
Return on average equity 15.13% 13.03%
Employees 2,778 -
CDP Score - -

Address

23A Serangoon North Avenue 5 #01-01 K&S Corporate Headquarters
FORT WASHINGTON, 554369
Singapore
+65-6-8809600 (Phone)
+65-6-8809580 (Fax)

Website links

External links

Analyst Estimates - MarketWatch
SEC Filings - EDGAR Online
Major Holders - MSN Money

Description

Kulicke and Soffa Industries, Inc. designs, manufactures and sells capital equipment and expendable tools, as well as services, maintains, repairs and upgrades equipment, all used to assemble semiconductor devices. The Company supplies a range of bonding equipment. The Company operates through two segments: Equipment and Expendable Tools. The Equipment segment manufactures and sells a line of ball bonders, wedge bonders, advanced packaging and surface mount technology solutions. The Expendable Tools segment manufactures and sells expendable tools for a range of semiconductor packaging applications. It offers capital equipment and expendable tools used to assemble semiconductor devices, including integrated circuits, high and low powered discrete devices, light-emitting diodes and power modules. Its customers primarily consist of semiconductor device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers and automotive electronics suppliers.

Officers and directors

Garrett E. Pierce Chairman of the Board
Age: 72
Bio & Compensation  - Reuters
Fusen Ernie Chen President, Chief Executive Officer, Director
Age: 57
Bio & Compensation  - Reuters
Jonathan H. Chou Chief Financial Officer, Executive Vice President, Chief Information Officer
Age: 52
Bio & Compensation  - Reuters
Lester A. Wong J.D. Senior Vice President - Legal Affairs, General Counsel
Age: 50
Bio & Compensation  - Reuters
Hoang Huy Hoang Senior Vice President - Global Sales and Products and Services
Bio & Compensation  - Reuters
Chan Pin Chong Senior Vice President , Electronic Assembly, Advanced Packaging-Hybrid, Wedge Bonder, Capillaries and Blades Business Lines
Age: 48
Bio & Compensation  - Reuters
Irene Lee Senior Vice President, Global Operations and Chief Quality Officer
Age: 56
Bio & Compensation  - Reuters
Deepak K. Sood Ph.D. Vice President - Global Engineering
Age: 55
Bio & Compensation  - Reuters
Nelson Wong Vice President - Ball and Die Bonder Business Unit Management
Age: 56
Bio & Compensation  - Reuters
Brian R. Bachman Independent Director
Age: 72
Bio & Compensation  - Reuters